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Interposer

Product Descriptions

Thin film interposer technologies are an alternative to the traditional probe technology, and are used to provide an electrically transparent temporary connection between chips and test equipment.

Utilizing a pad defined, isotropic conductive elastomer, the extremely short current path, low resistance, and ultra-low inductance and capacitance of this technology delivers the clearest possible picture of how your chips are performing. This technology is particularly effective with high-frequency and high-current chips.

Specifications

Bandwidth:	< -1 dB through 40 GHz
Inductance:	Self: 0.05 nH
Inductance:	Mutual: 0.015 nH
Capacitance:	Mutual: 0.005 pF
Contact DC Resistance:	< 50 mOhms
Current Carrying Capabilities:	< 4 Amps per pin @ ambient
Environmental:	-40˚C - 150˚C
Typical Contact Force:	15 – 25 grams / pin
Electrical Contact:	~ 0.012"
Contact Compliance:	0.003", 0.004", 0.005"
Contact Compliance:	standard configurations

Source: GateWave Northern Inc. February 2009

Low resistance, very low inductance and capacitance

Short Path

*The thickness may change depend on an application.

Low Contact Force	Current Carrying Capabilities
15-20g / Pin (Contact)	<4 Amps / Pin (Contact)

What is an Interposer