Thin film interposer technologies are an alternative to the traditional probe technology, and are used to provide an electrically transparent temporary connection between chips and test equipment.
Utilizing a pad defined, isotropic conductive elastomer, the extremely short current path, low resistance, and ultra-low inductance and capacitance of this technology delivers the clearest possible picture of how your chips are performing. This technology is particularly effective with high-frequency and high-current chips.
|Bandwidth:||< -1 dB through 40 GHz|
|Inductance:||Self: 0.05 nH Mutual: 0.015 nH|
|Capacitance:||Mutual: 0.005 pF|
|Contact DC Resistance:||< 50 mOhms|
|Current Carrying Capabilities:||< 4 Amps per pin @ ambient|
|Environmental:||-40˚C - 150˚C|
|Typical Contact Force:||15 – 25 grams / pin|
|Electrical Contact:||~ 0.012"|
|Contact Compliance:||0.003", 0.004", 0.005" standard configurations|
Source: GateWave Northern Inc. February 2009
Low resistance, very low inductance and capacitance
Thin Film Interposer
*The thickness may change depend on an application.
Low Contact Force
Current Carrying Capabilities
15-20g / Pin (Contact)
<4 Amps / Pin (Contact)
Notes: All specifications on this datasheet and production status are subject to change without notice. Prior to the purchase, please contact Sanyu Electric, Inc. for updated product specifications and request specification sheets for detailed product data.